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4 Makoto Nagata, "Power Delivery Network and Integrity in 3D-IC Chips (Chapter 3)," Handbook of 3D Integration, Volume 4: Design, Test, and Thermal Management (P. Franzon, E. Jan Marinissen, M. S. Bakir, Eds.,), Wiley, pp. 41-52, Mar. 2019.
3 Makoto Nagata, "Electromagnetic Noises (Chapter 4), VLSI Design and Test for Systems Dependability (Shojiro Asai Ed.)," Springer, pp. 129-161, Springer, July 2018.
2 Noriyuki Miura and Tadahiro Kuroda, "Design of 3D Integrated Circuits and Systems (Chapter 7: Inductive Coupling ThruChip Interface for 3D Integration)," CRC Press, pp.175-202, Nov. 2014.
1 分担執筆(永田編著, 永田, 他4名),「OHM大学テキスト・アナログ電子回路」, オーム社, 2013.3.20.