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国際会議論文(査読有り) 2017年

12 Kohei Matsuda, Tatsuya Fujii, Natsu Shoji, Takeshi Sugawara, Kazuo Sakiyama, Yu-ichi Hayashi, Makoto Nagata, Noriyuki Miura, " A 286F²/Cell Distributed Bulk-Current Sensor and Secure Flush Code Eraser Against Laser Fault Injection Attack," Dig. Tech. Papers, 2018 IEEE International Solid-State Circuits Conference (ISSCC), #21.5, pp. 352-353, Feb. 2018. (San Francisco)
11 Noriyuki Miura, Masanori Takahashi, Kazuki Nagatomo, Makoto Nagata, "Chaos, Deterministic Non-Periodic Flow, for Chip-Package-Board Interactive PUF," Proc. 2017 IEEE Asian Solid-State Circuits Conference (A-SSCC 2017), S3-2, pp. 25-28, Nov. 2017. (Seoul)
10 Takeshi Sugawara, Natsu Shoji, Kazuo Sakiyama, Kohei Matsuda, Noriyuki Miura, Makoto Nagata, "Exploiting Bitflip Detector for Non-Invasive Probing and its Application to Ineffective Fault Analysis," Proceedings of the IEEE 2017 Workshop on Fault Diagnosis and Tolerance in Cryptography (FDTC 2017), #3.2, pp. 49-56, Sep. 2017. (Taipei)
DOI: 10.1109/FDTC.2017.17
9 Akihiro Tsukioka, Makoto Nagata, Kohki Taniguchi, Daisuke Fujimoto, Rieko Akimoto, Takao Egami, Kenji Niinomi, Takeshi Yuhara, Sachio Hayashi, Rob Mathews, Karthik Srinivasan, Ying-Shiun Li, Norman Chang, "Simulation Techniques for EMC Compliant Design of Automotive IC Chips and Modules," Proceedings of the 2017 International Symposium on Electromagnetic Compatibility (EMC Europe 2017), #O_Th_A2_2, pp. 1-5, Sep. 2017. (Angers)
8 Ko Oyama, Yosuke Kondo, Daisaku Ikoma, Yasuyuki Ishikawa, Akitaka Murata, Shuji Agatsuma, Makoto Nagata, "Effect of Field Area on Disturbance Propagation through Silicon Substrates in SOI-BCD Process," Proceedings of the 2017 International Symposium on Electromagnetic Compatibility (EMC Europe 2017), #O_We_C2_3, pp. 1-5, Sep. 2017. (Angers)
7 Daisuke Ishihata, Naofumi Homma, Yu-ichi Hayashi, Noriyuki Miura, Daisuke Fujimoto, Makoto Nagata, Takafumi Aoki, "Enhancing Reactive Countermeasure against EM Attacks with Low Overhead," Proceedings of the 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, #WED-AM-4-2, pp. 399-404, Aug. 2017. (Washington, DC)
6 Yasunori Miyazawa, Satoshi Tanaka, Masahiro Nishizawa, Jingyan Ma, Masahiro Yamaguchi, Koichi Kondo, Makoto Nagata, Yasuyuki Okiyoneda, "Analysis of Unnecessary Radio Wave Near the Inverter Equipment at the Carrier Frequency-Range of Mobile Terminal," Proceedings of the 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, Poster, pp.283-287, Aug. 2017. (Washington, DC)
5 Kohki Taniguchi, Makoto Nagata, Akihiro Tsukioka, Daisuke Fujimoto, Noriyuki Miura, Takao Egami, Rieko Akimoto, Kenji Niinomi, Terumitsu Komatsu, Yoshinori Fukuba, Atsushi Tomishima, "Susceptibility Evaluation of CAN Transceiver Circuits with In-Place Waveform Capturing under RF DPI," in Proceedings of the 11th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2017), pp. 59-63, July 2017. (St. Petersburg)
4 Masahiro Yamaguchi, Yasushi Endo, Peng Fan ,Jingyan Ma ,Satoshi Tanaka, Yasunori Miyazawa,Makoto Nagata, "Analysis of Patterned Magnetic Thin-film Noise Suppressor for RF IC Chip," in Proceedings of the 11th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2017), pp. 45-49, July 2017. (St. Petersburg)
3 Noriyuki Miura, Kohei Matsuda, Makoto Nagata, Shivam Bhasin, Ville Yli-Mayry, Naofumi Homma, Yves Mathieu, Tarik Graba, Jean-Luc Danger, "A 2.5ns-Latency 0.39pJ/b 289µm²/Gb/s Ultra-Light-Weight PRINCE Cryptographic Processor," 2017 Symposium on VLSI Circuits, Dig. of Tech. Papers, #20.2, pp. 266-267, June 2017. (Kyoto)
2 Masahiro Yamaguchi, Satoshi Tanaka, Jingyan Ma, Yasunori Miyazawa, Mitsuharu Sato, Masahiro Nishizawa, Makoto Nagata, Kazushi Ishiyama, Koichi Kondo, Yasuyuki Okiyoneda, "Magnetic Integrated Passives for Information and Communication Technology (Invited)", INTERMAG Europe 2017, BA-03, 2017.4.25. (Dublin)
1 Hiroaki Ikeda, Shigenobu Sekine, Ryuji Kimura, Koichi Shimokawa, Keiji Okada, Hiroaki Shindo, Tatsuya Ooi, Rei Tamaki, Makoto Nagata, "Cu-Sn Based Joint Material Having IMC Forming Control Capabilities," in Proceedings of International Conference on Electronics Packaging (ICEP 2017), #TC4-2, pp. 171-176, Apr. 2017. (Yamagata)